The purpose of this module is to introduce students to the fundamentals of semiconductor process technology focusing on silicon technology and integrated circuit processes.

Semiconductor technology: overview of advances in integrated circuits, the road map, Moore's law. General nature of semiconductor materials: elemental materials and their uses in research and industry, compound materials and alloys and their applications, influence of purity on electrical properties of semiconductors. Structure of semiconductors: amorphous, crystalline and polycrystalline solids, unit cells, lattice types, body centred cubic, face centred cubic, the diamond lattice, Si. Semiconductor Junctions and Devices: electrical properties, contribution of mobility and free carrier density to resistivity, electrical properties of conductors, semiconductors and insulators. Semiconductors: pure semiconductors, important elements from group 3, group 4 and group 5 of the periodic table, valence electrons, covalent bonding, p-type semiconductors and n-type semiconductors, energy levels for p-type and n-type semiconductors, intrinsic energy level, intrinsic carrier density, thermal equilibrium, carrier lifetime. Doping of silicon: donors and acceptors, majority carriers and minority carriers; Lithography: lithography processes, optical lithography techniques, exposure. Printing. Advanced lithography: focused ion beam, electron beam. Thermal oxidation of silicon: the oxidation process, type of furnaces, wet oxidation, dry oxidation, factors influencing oxidation rates, silica film thickness measurements. Thin film deposition: evaporation, sputtering, chemical vapour deposition. Diffusion: diffusion processes, constant source diffusion, limited source diffusion, solid solubility limits. Ion implantation: implantation technology, channelling, lattice damage and annealing.

On successful completion of this module, students will be able to: 1) Discuss key concepts relating to structure, properties, diffusion and ion implantation in silicon. 2) Explain the physical concepts underlying semiconductor process technology. 3) Discuss the principles of lithography in relation to silicon technology and integrated circuit processes. 4) Derive relevant equations describing semiconductor process technology, from basic laws and principles. 5) Solve numerical problems from information provided on the topics covered. 6) Perform experiments requiring precise measurement. 7) Use mechanical, optical and electronic apparatus for observation and measurement.

On successful completion of this module, students will be able to: 1) Discuss the value of silicon technology and integrated circuit processes in applied physics.

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The module will be taught via interactive lecture, experiential tutorial, problem-based private study, self directed learning, recommended reading, reflection on and application to physics-related research problems, enquiry based learning, observation, demonstration, skills acquisition and adaptation, mentorship and lab supervision. Students will learn basic concepts and learn how apply their knowledge to solve physical and numerical problems.